JPH0539513Y2 - - Google Patents
Info
- Publication number
- JPH0539513Y2 JPH0539513Y2 JP3221087U JP3221087U JPH0539513Y2 JP H0539513 Y2 JPH0539513 Y2 JP H0539513Y2 JP 3221087 U JP3221087 U JP 3221087U JP 3221087 U JP3221087 U JP 3221087U JP H0539513 Y2 JPH0539513 Y2 JP H0539513Y2
- Authority
- JP
- Japan
- Prior art keywords
- memory
- hole
- erasing
- circuit board
- circuit block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000015654 memory Effects 0.000 claims description 40
- 238000000465 moulding Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000001568 sexual effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000012790 confirmation Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- XUFQPHANEAPEMJ-UHFFFAOYSA-N famotidine Chemical compound NC(N)=NC1=NC(CSCCC(N)=NS(N)(=O)=O)=CS1 XUFQPHANEAPEMJ-UHFFFAOYSA-N 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221087U JPH0539513Y2 (en]) | 1987-03-05 | 1987-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3221087U JPH0539513Y2 (en]) | 1987-03-05 | 1987-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63139587U JPS63139587U (en]) | 1988-09-14 |
| JPH0539513Y2 true JPH0539513Y2 (en]) | 1993-10-06 |
Family
ID=30838672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3221087U Expired - Lifetime JPH0539513Y2 (en]) | 1987-03-05 | 1987-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0539513Y2 (en]) |
-
1987
- 1987-03-05 JP JP3221087U patent/JPH0539513Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63139587U (en]) | 1988-09-14 |
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